We skip navigation

Musashi Engineering, Inc. of dispenser

Top page > Application example > Production method Group > Semiautomatic > Encapsulation to PCB Substrate

Contents start

Encapsulation to PCB Substrate

Encapsulation to PCB Substrate

Dispensing work to PCB Substrate may not be position that Dispensing position has the same as fixed on the working plate by all means to be uneven in Substrate dimension of PCB Substrate itself.
We recognize mounting position or Inclination of tip to seal Chip mounted on the board exactly, and there is The automatic modification of dispensing positions need.




[domestically]
・Consideration of apparatus introduction, dispensing test, demonstration func rental, consultation about estimate and inquiry are this.
・Domestic business and confirmation of tech support-response Branch are this.

[abroad]
・Consideration of apparatus introduction, dispensing test, demonstration func rental, consultation about estimate and inquiry are this.
・Business and confirmation of tech support-response Branch are this.

When the nearest business base is unclear, please ask to inquiry form.
We put notification from the business base of charge or agency.

Musashi of FA, dispenser synthesis maker turn to problem that cannot be settled to solution with customer from nozzle to dispenser, Desktop robot of various dispense methods, robot at right angles, Full Automation coating applicator only by single dispense mechanism and does suggestion of the most suitable apparatus. Please consult by all means.


Guidance of inquiry window

Inquiry over telephone:
Inquiry over telephone to 0422-76-7111

Inquiry from WEB site:
To inquiry form

FAQs

Such as things about product
We will reply question.