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Musashi Engineering, Inc. of dispenser

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Encapsulation to PCB Substrate

Encapsulation to PCB Substrate

Dispensing work to PCB Substrate may not be position that Dispensing position has the same as fixed on the working plate by all means to be uneven in Substrate dimension of PCB Substrate itself.
We recognize mounting position or Inclination of tip to seal Chip mounted on the board exactly, and there is The automatic modification of dispensing positions need.

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