We skip navigation

Musashi Engineering, Inc. of dispenser
Contents start

Die-bonding to lead frame

Die-bonding to lead frame

In multi-kind production of electronic devices, it is adaption for tip of various shapes and size in process of die-bonding to implement semiconductor chip in lead frame and Substrate. How quickly is The importance in today's process in The dispensing modes can be re-programmed in addition to the stability of dispensing volume., too.


Guidance of inquiry window

Inquiry over telephone:
Inquiry over telephone to 0422-76-7111

Inquiry from WEB site:
To inquiry form

FAQs

Such as things about product
We reply question.