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Musashi Engineering, Inc. of dispenser
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Die-bonding to lead frame

Die-bonding to lead frame

In multi-kind production of electronic devices, it is adaption for tip of various shapes and size in process of die-bonding to implement semiconductor chip in lead frame and Substrate. How quickly is The importance in today's process in The dispensing modes can be re-programmed in addition to the stability of dispensing volume., too.

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