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Musashi Engineering, Inc. of dispenser

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News of 2013 adhesion, junction technique exhibition exhibition

Date
From Wednesday, September 25, 2013 to Friday, September 27
From 10:00 to 17:00

Place
Number between the Tokyo Big Sight small: East 2 hall 2D-15

Display contents
As No. 1 dispenser synthesis manufacturer, "the adhesion" exhibits for exhibition "2013 adhesion, junction technique exhibition" about materials, technique that featured the theme of "the joining".

We suggest dispensing system which is suitable to various adhesive (UV adhesive, 2 liquid adhesive, reactive hot melt, fast-acting adhesives), bonding materials (solder, conductive paste).

In addition, we display small amount solder joining system, high speed, non-contact dispensing system of adhesive and high precision, hairline dispensing system of sealant.

Please arrive to our booth.

Detailed page of 2013 adhesion, junction technique exhibition