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Musashi Engineering, Inc. of dispenser

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News of 2014 adhesion, joining, fastening technology exhibition exhibition

Date
From Wednesday, September 17, 2014 to Friday, September 19
From 10:00 to 17:00

Place
Number between the Tokyo Big Sight small: East 3 hall D-10

Display contents
As No. 1 dispenser synthesis manufacturer, exhibition about materials, technique that we featured the theme of exhibits "fastening" for "2014 adhesion, joining, fastening technology exhibition" "the joining" "the adhesion".

We suggest dispensing system which is suitable to various adhesive (UV adhesive, 2 liquid adhesive, reactive hot melt, fast-acting adhesives) and bonding material (cream solder, conductive paste).

We display cream solder non-contact dispensing & laser joining system and precisely, extra fine wire dispensing system of hot melt with demonstration.

Please arrive to our booth.


Detailed page of 2014 adhesion, joining, fastening technology exhibition