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News of SMT Hybrid Packaging 2016 exhibition

Date
From Tuesday, April 26, 2016 to Thursday, April 28
From 09:00 to 17:00
Place
Exhibition Centre Nuremberg Messe, Germany HALL7 No. 7-245

Display contents
Display demonstrates the highest FA dispensing system contributing to high precision, small amount dispensing, the adhesion in process of manufacture of semiconductor, implementation field and neighboring fields, joining process.

Person having problem, productivity which is interested in one where improvement and cost cut are examined, the highest Dispensing technology come to right or wrong, our booth for dispensing process.
Detailed page of SMT Hybrid Packaging 2016