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Musashi Engineering, Inc. of dispenser

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News of Bondexpo 2016 exhibition

Date
From Monday, October 10, 2016 to Thursday, October 13
From 09:00 to 17:00
Place
Landesmesse Stuttgart GmbH, Germany
HALL9 No. 9220

Display contents
Display demonstrates advanced dispensing system of Japan contributing to adhesive, sealant, sorudapesuto in process of manufacture of neighboring fields mainly on Automative, high precision, small amount dispensing, the adhesion of 2 liquid mixing die material, joining process in cathedral.

[new product] Ultrafast, non-contact jet dispenser "SuperJet"
[high precision] PC control image recognition desk gate type robot "350PC Smart" with
[new technology] mono-type digital control dispenser "MOHNOMASTER"
Very popular! Heat radiation materials dispensing system "MPP-3"
[high subtly] Full Automation Substrate coating machine "FCD1000"
[high-quality] Full Automation multi-purpose dispensing machine "FAD2500"

Person having problem, productivity which is interested in one where improvement and cost cut are examined, the highest Dispensing technology come to right or wrong, our booth for dispensing process.
Detailed page of Bondexpo2016