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Musashi engineering of dispenser

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News of SEMICON Southeast Asia 2017 exhibition

Date
From Wednesday, April 25, 2017 to Friday, April 27
From 10:00 to 17:00 (only on the last day until 16:00)

Place
Spice Arena, Penang,Malaysia
Stand No. 214

Display contents
Including smart phone in ASEAN area, wearable terminal, Automative, sensor, display demonstrates the highest dispensing system contributing to semiconductor, implementation of advanced field, high precision, small amount dispensing, the adhesion, the joining in process of manufacture, coating process.
In addition, in die-bonding process, full model changeover exhibits new life SUPERΣCMIII at ASEAN area Σ dispenser proud of the overwhelming delivery results to for the first time at last at this time.
Please arrive to Musashi engineering booth suggesting total solution from nozzle to Full Automation device by all means.

[bestseller] Full Automation multi-purpose dispensing machine "FAD2500"
[super compact] Full Automation compact dispensing machine "TAD1000M"
[in-line orthogonality type robot] "CROSSMASTER"
[the results overwhelming for die-bonding process!] "SUPERΣCMIII"
[non-contact Sor da paste coating] "SOLDERJET"
[non-contact PUR dispensing] "HOTMELT SUPERJET"
[liquid gasket (CIPG/FIPG) dispensing] mono-type dispenser "MOHNOMASTER"

Person having problem, productivity which is interested in one where improvement and cost cut are examined, the highest Dispensing technology come to right or wrong, our booth for dispensing process.
Detailed page of 2017 SEMICON Southeast Asia