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News of 2017 Bond Expo exhibition

Date
From Monday, October 9, 2017 to Thursday, October 12
From 09:00 to 17:00
Place
Landesmesse Stuttgart GmbH, Germany
HALL6 No. 6526

Display contents
Display demonstrates advanced dispensing system of Japan contributing to adhesive, sealant in process of manufacture of neighboring fields mainly on Automative, Sor da paste, high precision, small amount dispensing, the adhesion of 2 liquid mixing die material, joining process in cathedral.

[new product] Ultrafast, non-contact jet dispenser "SuperJet"
[new product] Fully digital control dispenser "SUPERΣCMIII"
[high precision] PC control image recognition desk gate type robot "350PC Smart" with
[CIPG/FIPG] mono-type digital control dispenser "MOHNOMASTER"
Very popular! 2 humoral heat radiation materials dispensing system "MPP-3"
[conformal coating] Full Automation Substrate coating machine "FCD1000"
[high-quality] Full Automation multi-purpose dispensing machine "FAD2500"

Person having problem, productivity which is interested in one where improvement and cost cut are examined, the highest Dispensing technology come to right or wrong, our booth for dispensing process.
Detailed page of Bondexpo2017