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Musashi Engineering, Inc. of dispenser

Top page > List of topics > Exhibition information > Announcement of Kansai adhesion, joining EXPO exhibition exhibition

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Announcement of Kansai adhesion, joining EXPO exhibition exhibition

From Wednesday, May 9, 2018 to Friday, May 11
10:00-18:00 (most whole day 17:00)

INTEC's Osaka Building No. 6 A No.A0-13

Display contents
Actual machine displays wide product line before Manually supporting the adhesion, the joining process (solder paste, heat radiation materials, moisture-proof materials, grease, liquid gasket, hot melt, 2 liquid adhesive dispensing) and thread fastening in manufacturing such as motor parts, electronic parts, mechanism element, Bali collecting process including smartphone, wearable terminal as No. 1 dispenser synthesis manufacturer reaching semiautomatic, Full Automation. Please see "the latest dispensing system" by all means.

・Full Automation Substrate coating device "FCD1000"
・JET series latest model appearance! Ultrafast, micronon-contact dispensing "SuperJET"
・High speed, non-contact dispensing system "solder jet" of solder paste
・Is 1 system by dispensing + laser solder joining; realization "dispensing laser master"
・High speed, multi-Dotting dispensing "parallel jet" to solid thing
・Air-fuel ratio freedom of 2 humoral adhesive. "2 liquid heat radiation adhesive dispensing system"
・Dispensing system "350PCSmart" with 3D alignment function-based image recognition function

Other than the above, please see "the latest FA, dispensing system" of Musashi who can suggest widely from Manually to semiautomatic, large Full Automation device including parts by all means.

Detailed page of 2018 Kansai adhesion, joining EXPO

Application for invitation from this.

In addition, please feel free to contact to our business base of neighborhood as you distribute invitation from our business.