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Musashi Engineering, Inc. of dispenser

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Announcement of Semicon Southeast Asia 2018 exhibition

Date
From Tuesday, May 22, 2018 to Thursday, May 24
The first day of 9:00-17:00
The 10:00-17:00 second day (only on the last day until 16:00)

Place
Malaysia International Trade and Exhibition Centre (MITEC)
Stand No. 612

Display contents
Including smart phone in ASEAN area, wearable terminal, Automative, sensor, display demonstrates the highest dispensing system contributing to semiconductor, implementation of the advanced field, high precision, small amount dispensing, the adhesion, the joining in process of manufacture, coating process.

Please arrive to Musashi Engineering booth suggesting total solution from nozzle to Full Automation device.

[bestseller] Full Automation multi-purpose dispensing machine "FAD2500"
[in-line model robot at right angles] "CROSSMASTER"
[non-contact solder paste coating] "SOLDERJET"
[2 liquid type thermal conductivity gap packing material dispensing system] "MPP-3"
[liquid gasket (CIPG/FIPG) dispensing] mono-type dispenser "MOHNOMASTER"
[high precision screw dispenser] "SCREWMASTER3"

Person having problem, productivity which is interested in where improvement and cost cut are examined, the highest Dispensing technology come to right or wrong, our booth for dispensing process.
Detailed page of SEMICON Southeast Asia 2018