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Musashi Engineering, Inc. of dispenser

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News of 2018 Bond Expo exhibition

From Monday, October 8, 2018 to Thursday, October 11
Landesmesse Stuttgart GmbH, Germany
HALL6 No. 6516

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Display demonstrates advanced dispensing system of Japan contributing to adhesive, sealant in process of manufacture of the neighboring fields mainly on Automative, solder paste, high precision, small amount dispensing, the adhesion of 2 liquid mixing die material, the joining process in a large hall.

[new product] Ultrafast, non-contact jet dispenser "SuperJet"
[new product] Fully digital control dispenser "SUPERΣCMIII"
[high precision] PC control image recognition desk gate type robot "350PC Smart" with
Very popular! 2 humoral heat radiation materials dispensing system "MPP-3"
[high precision] High precision orthogonality type robot "CROSSMASTER"
[conformal coating] Full Automation Substrate coating machine "FCD1000"
[high-quality] Full Automation multi-purpose dispensing machine "FAD2500"

Person having problem, productivity which is interested in one where improvement and cost cut are examined, the highest Dispensing technology come to right or wrong, our booth for dispensing process.
Detailed page of Bondexpo2017