We skip navigation

Musashi Engineering, Inc. of dispenser

Top page > List of topics > Exhibition information > Announcement of Kansai adhesion, joining EXPO exhibition

Contents start

Announcement of Kansai adhesion, joining EXPO exhibition

Date
From Wednesday, May 22, 2018 to Friday, May 24
10:00-18:00 (most whole day 17:00)

Place
INTEC's Osaka Building No. 1 No. 5-22

Display contents
Actual machine displays wide product line before Manually supporting the adhesion, the joining process (solder paste, heat radiation materials, moisture-proof materials, grease, liquid gasket, hot melt, 2 liquid adhesive dispensing) and thread fastening in manufacturing such as motor parts, electronic parts, mechanism element, Bali collecting process including smartphone, wearable terminal as No. 1 dispenser synthesis manufacturer reaching semiautomatic, Full Automation. Please see "the latest dispensing system" by all means.

・[the world first to go out product] High viscosity correspondence jet dispenser "Super Hi Jet"
・[ultrafast, micronon-contact dispensing] Ultrafast, jet dispenser "SuperJET"
・[solder paste correspondence] JET dispenser "solder Jet"
・[the highest peak of air-type dispenser] "SuperΣCMIII"
・[mono-type dispenser] "MOHNOMASTER"
・Air-fuel ratio freedom of 2 humoral adhesive. "2 liquid heat radiation adhesive dispensing system"
・Dispensing system "350PCSmart" with 3D alignment function-based image recognition function


Other than the above, please see "the latest FA, dispensing system" of Musashi who can suggest widely from Manually to semiautomatic, large Full Automation device including parts by all means.

Detailed page of 2019 Kansai adhesion, joining EXPO

Application for invitation from this.

In addition, please feel free to contact to our business base of neighborhood as you distribute invitation from our business.