We skip navigation

Musashi Engineering, Inc. of dispenser

Top page > List of topics > Exhibition information > Announcement of 2019 Bond Expo exhibition

Contents start

Announcement of 2019 Bond Expo exhibition

Date
From Monday, October 7, 2019 to Thursday, October 10
09:00-17:00
Place
Landesmesse Stuttgart GmbH, Germany
HALL6 No. 6434

Display contents
Display demonstrates advanced dispensing system of Japan contributing to adhesive, sealant in process of manufacture of the neighboring fields mainly on Automative, solder paste, high precision, small amount dispensing, the adhesion of 2 liquid mixing die material, the joining process in one place.

[new product] Ultrafast, non-contact jet dispenser "SuperJet"
[new product] Fully digital control dispenser "SUPERΣCMIII"
[high precision] PC control image recognition desk gate type robot "350PC Smart" with
Very popular! 2 humoral heat radiation materials dispensing system "MPP-3"
[high precision] High-precision model robot "CROSSMASTER" at right angles
[conformal coating] Full Automation Substrate coating machine "FCD1000"
[high quality] Full Automation multi-purpose dispensing machine "FAD2500"

Person having problem, productivity which is interested in where improvement and cost cut are examined, the highest Dispensing technology come to right or wrong, our booth for dispensing process.
Detailed page of Bondexpo2019